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Leading thermal resistance performance 0.12 °C/W. |
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| - Patented VGF (Vortex Generator Flow) technology to greatly increase air convection. |
| - Unique air path creating high VEF (Vacuum Effect Flow) to optimize the airflow. |
| - Each heat pipes soldered to the fins and bases for a definite contact in producing high efficiency rate of heat transfer. |
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Down flow design to cool CPU and its surrounding devices such as MOSFET and North bridged chipset. |
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Six Ø6mm heat pipes crossed from two sides of the heat sink to greatly improve cooling performance. |
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Nickel-plated heat pipes to reduce oxidation effect and maintain the top performance for long-term usage. |
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Patented universal brackets. |
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| - Support Intel® LGA 775/1155/1156/1366, AMD® AM2/AM2+/AM3/ AM3+/FM1/FM2. |
| - Apply AAP (Auto-Adjustable-Pressure) design giving perfect contact force (18~28kgw) between CPU and cooler. |
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Unique T.B.Silence with PWM fan to adjust the power efficiently. |
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Anti-vibration rubbers prevent fan vibration and absorb noise. |
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High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink. |
